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What is the purpose of ammonia when using a copper pyrophosphate brightener? How to control its content? Let's analyze it in this issue.
In the application production of alkaline copper plating brightener, why the top layer of the workpiece in the row above the hangers appears to blister, and the base metal shows small brown circles and gray-brown stains? In fact, it is possible that the plating solution is contaminated.
In the process of using acid galvanizing brightener, there are some plating plant plating solution is easy to produce floating oil, is floating in the plating liquid surface of the oil, what to do?
Why do fine pockmarks appear on the coating in the production process using pyrophosphate copper plating additives? It might be caused by the turbidity of the bath solution. Then why does the bath solution become turbid? Overall, there are three reasons.
Some customers ask that in the production process of tin plating brightener, the stability of the plating solution can be good, so that the workpiece can get good ductility, solderability and corrosion resistance. So how do we operate in order to make the plating of the stability of good performance, and can effectively extend the service life of the plating solution?
The use of high sulfur nickel additives can obtain nickel plating with sulfur content of 0.12%~0.25%, which is mainly used for the protection of steel, zinc alloy substrate and the intermediate layer of decorative plating, and can effectively improve the corrosion resistance of the plating. So how should we maintain the plating solution when using high sulfur nickel additives?
